| Category |
Title |
Author |
pp.x-x |
PDF |
| Spot |
Laser precision microfabrication |
K.Sugioka |
p.1 |
 |
| R & Tech. Review |
Development and application of new high-power laser beam sources |
R.Poprawe and W.Schulz |
pp.3-10 |
 |
| R & Tech. Review |
Laser applications overview: The state of the art and the future trend in the United States |
C.Phipps |
pp.11-19 |
 |
| R & Tech. Review |
Challenge to advanced laser materials processing in Japanese industry |
I.Miyamoto |
pp.20-28 |
 |
| R & Tech. Review |
Diagnostics of particle dynamics during optically functional thin-film deposition by laser ablation |
T.Okada, Y.Nakata, and M.Maeda |
pp.29-33 |
 |
| R & Tech. Review |
Atom lithography with laser-cooled silicon atoms |
H.Kumagai, Y.Asakawa, T.Iwane, K.Midorikawa, and M.Obara |
pp.34-37 |
 |
| R & Tech. Review |
Optical waveguide filter fabricated by excimer laser irradiation |
J.Nishii, K.Kintaka, Y.Kawamoto, and M.Takahashi |
pp.38-41 |
 |
| R & Tech. Review |
Enhance refractive index modification of fused silica by multiwavelength excitation process using F2 and KrF excimer lasers |
K.Obata, K.Sugioka, K.Toyoda, and K.Midorikawa |
pp.42-46 |
 |
| R & Tech. Review |
Laser-induced chemical micro-treatment and synthesis of materials |
S.Metev, A.Stephen, J.Schwarz, and C.Wochnowski |
pp.47-52 |
 |
| R & Tech. Review |
Laser tuning silicon microdevices for analogue microelectronics |
M.Meunier, M.Cadotte, and M.Ducharme |
pp.53-56 |
 |
| R & Tech. Review |
Laser direct-write of miniature sensor and microbattery systems |
A.Piqué, C.B.Arnold, R.C.Wartena, B.Pratap, B.Shashishekar, K.E.Swider-Lyons, D.W.Weir, and R.A.Kant |
pp.57-62 |
 |
| R & Tech. Review |
Extreme ultraviolet light sources--State of the art, future developments, and potential applications |
U.Stamm |
pp.63-70 |
 |
| R & Tech. Review |
Ultrafast laser material processing using dynamic temporal pulse shaping |
R.Stoian, M.Boyle, A.Thoss, A.Rosenfeld, G.Korn, and I.V.Hertel |
pp.71-76 |
 |
| R & Tech. Review |
Femtosecond technology for precision manufacturing: Fundamental and technical aspects |
F.Dausinger |
pp.77-82 |
 |
| R & Tech. Review |
Microstructuring of SiC by laser ablation with pulse duration from ns to fs range |
E.W.Kreutz, R.Weichenhain, R.Wagner, and A.Horn |
pp.83-86 |
 |
| R & Tech. Review |
Precise deep drilling of metals by femtosecond laser pulses |
A.Ostendorf, G.Kamlage, and B.N.Chichkov |
pp.87-89 |
 |
| R & Tech. Review |
Toward nano- and microprocessing in glass with femtosecond laser pulses |
K.Itoh and W.Watanabe |
pp.90-94 |
 |
| R & Tech. Review |
Time-resolved dynamics of plasma formation and refractive index modification in silica glasses excited by a femtosecond laser |
S.-H.Cho, H.Kumagai, and K.Midorikawa |
pp.95-100 |
 |
| R & Tech. Review |
3D microstructuring inside Foturan glass by femtosecond laser |
Y.Cheng, K.Sugioka, M.Masuda, K.Toyoda, M.Kawachi, K.Shihoyama, and K.Midorikawa |
pp.101-106 |
 |
| R & Tech. Review |
Femtosecond laser micromachining: Current status and applications |
N.H.Rizvi |
pp.107-112 |
 |
| R & Tech. Review |
Medical applications for ultrafast laser pulses |
H.Lubatschowski, A.Heisterkamp, F.Will, A.I.Singh, J.Serbin, A.Ostendorf, O.Kermani, R.Heermann, H.Welling, and W.Ertmer |
pp.113-118 |
 |